Junction fabrication process is ported to a new oxygen plasma asher. This new tool significantly simplifies the process, improves critical current uniformity, and improves the uniformity of how the junctions age with time.
First wafer probed using the newly delivered automated probe station. This tool allows us to gather statistics on a significantly larger number of junctions per wafer.
Acceptance certificate signed after delivery and commissioning of the Raith EBPG 5150. The machine’s self-calibration protocol, combined with exceptional environmental stability, provides highly reproducible lithography.